The TestEQ EUT-series high temperature oven is an electrically heated, air-circulation chamber for wafer baking and dehydration, component drying, polymer and photoresist curing, and package baking. It is used in semiconductor manufacturing, electronics production and materials processing where stable temperature control and repeatable thermal cycles matter.
Applications
- Wafer baking and wafer dehydration
- Photoresist and polymer thermal processing
- Semiconductor packaging: die attach curing, epoxy curing, underfill curing
- IC package baking and post-molding thermal treatment
- Semiconductor component drying and moisture removal
- Electronics component baking and ageing
- Clean thermal processing and process development (R&D)
Configuration and features
- Temperature range RT to 200 °C standard; 300–500 °C available as an option.
- Temperature fluctuation ≤ ±0.5 °C and temperature deviation ≤ ±2.0 °C.
- Heating time from RT to 200 °C approximately 35 minutes.
- Contactless equal-period pulse width modulation heating control using SSR (Solid State Relay).
- K-type armored thermocouple for temperature measurement.
- Air circulation for even heat distribution across the working volume.
- Stainless steel chamber construction with multi-layer shelves.
- PLC or touchscreen controller; data logging, remote monitoring and MES integration available as options.
- Safety features: leakage circuit breaker, fan overheat protection, over-temperature protection, thermal fuse, air duct extreme over-temperature protection.
- Observation glass window fitted on RT–200 °C models; the 200 °C–500 °C configuration is supplied without an observation glass window.
- Optional configurations include Nitrogen Inert Oven, Vacuum Oven, Class 100 Clean Oven, Multi-Chamber Oven, Automatic Loading System, Data Logging System and MES Communication Interface.
- Custom chamber dimensions, wafer carriers, shelves and fixtures on request.
Specifications
Model range
| Parameter | EUT91 | EUT216 | EUT512 | EUT1000 |
|---|---|---|---|---|
| Capacity (m³) | 0.091 | 0.216 | 0.512 | 1.0 |
| Internal dimension WxHxD (mm) | 450x450x450 | 600x600x600 | 800x800x800 | 1000x1000x1000 |
| External dimension WxHxD (mm) | 1040x820x635 | 1190x970x785 | 1500x1210x1065 | 1730x1480x1275 |
Common specifications
| Parameter | Value |
|---|---|
| Model series | High Temperature Oven, EUT |
| Temperature range | RT–200 °C (300–500 °C is optional) |
| Temperature fluctuation | ≤ ±0.5 °C |
| Temperature deviation | ≤ ±2.0 °C |
| Temperature rising speed rate | RT–200 °C, approx. 35 mins |
| Heating control method | Contactless equal-period pulse width modulation, SSR (Solid State Relay) |
| Temperature measurement | K-type armored thermocouple |
| Safety features | Leakage circuit breaker, fan overheat protection, over-temperature protection, thermal fuse, air duct extreme over-temperature protection |
| Observation glass window | RT–200 °C: with observation glass window. 200 °C–500 °C: without observation glass window |
| Power | AC220V, 1 phase 3 lines, 50/60Hz; AC380V, 3 phase 5 lines, 50/60Hz |
Standards
The oven can be configured for thermal processing associated with semiconductor manufacturing, packaging and reliability qualification. Applicable standards depend on the specific process, product and customer qualification requirements:
- JEDEC JESD22 reliability standards — common reliability test methods for semiconductor devices and packages.
- JEDEC JESD22-A104 temperature cycling — temperature cycling methods used for semiconductor reliability evaluation.
- SEMI standards — relevant semiconductor manufacturing practices and equipment requirements, depending on the application.
Final specifications should be set according to the actual thermal process, temperature uniformity, atmosphere, cleanliness, loading method and production requirements rather than a single standard alone. To size a chamber or match a configuration to a wafer, package or fixture, contact us with the product dimensions, required temperature profile, atmosphere and loading method. Related: High and Low Temperature Humidity Test Chamber , Custom Non-standard Test Chamber .