The TestEQ thermal vacuum cleaning system combines controlled heating, vacuum extraction and optional inert-gas purging to remove residual moisture, volatile compounds and hydrocarbons from semiconductor manufacturing equipment parts. It is built for semiconductor fabs, equipment manufacturers, component refurbishment facilities and high-purity manufacturing environments that need repeatable thermal processing and contamination control.
Applications
- Semiconductor equipment parts drying and preparation
- Vacuum bake-out of precision components
- Moisture removal and removal of volatile organic residues
- Outgassing reduction for vacuum-compatible assemblies
- Cleaning and preparation of process chamber components
- Drying after aqueous or solvent-based cleaning
- Pre-conditioning of components before installation
Configuration and features
- Chamber evacuated by a vacuum system selected for the required pressure range, chamber volume and process load.
- Controlled heating according to a defined temperature recipe, with programmable thermal profiles.
- Vacuum bake-out stage that continuously extracts released contaminants.
- Optional nitrogen or compatible inert-gas purge for pressure cycling, cooling or removal of residual volatiles.
- Controlled cooling and venting sequence before the chamber returns to atmospheric pressure.
- Low-outgassing SUS304 / SUS316L chamber construction and component-specific fixtures.
- PLC + touchscreen HMI control with recipe management, data logging, alarms and interlocks.
- Fully automatic or semi-automatic operation.
- Patent number CN202510795397.6.
Specifications
| Parameter | Value |
|---|---|
| Vacuum level | ≤ -0.1 MPa (customisable) |
| Temperature range | ambient to 450 °C |
| Temperature control accuracy | ±1 °C |
| Chamber material | SUS304 / SUS316L low-outgassing stainless steel |
| Heating mode | radiant / conduction hybrid heating |
| Cleaning mode | thermal + vacuum + optional gas assist |
| Cycle time | 30–120 minutes |
| Control system | PLC + touchscreen HMI |
| Automation | fully automatic / semi-automatic |
Actual temperature range, ultimate vacuum, pumping speed, heating rate, thermal uniformity and cycle time are confirmed against the customer’s component, contamination level and required process specification. Chamber dimensions, temperature range, vacuum architecture, fixtures, gas purging and data logging can be customised.
Standards
The applicable cleanliness, material-compatibility and vacuum requirements depend on the customer’s manufacturing process and component specification. Relevant areas include SEMI semiconductor manufacturing requirements, ISO 14644 cleanroom and contamination control, and ASTM E595 outgassing evaluation.
To define the chamber, vacuum system, fixtures and process recipe, contact us with the component dimensions, material, contamination type, required temperature and vacuum level. Related: Thermal Vacuum Chamber , Custom Non-standard Test Chamber .