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The TestEQ ETS-series thermal shock test chamber exposes a specimen to abrupt transitions between hot and cold zones to evaluate thermal shock resistance. A two-zone or three-zone layout is selected according to whether the specimen can be moved during the test.

Thermal shock test chamber

Applications

  • Semiconductors, ICs and electronic components
  • PCB assemblies and solder joints
  • Automotive electronics and EV power components
  • Aerospace, defense and communication equipment
  • New materials, glass, ceramics and composites
  • Batteries and power modules

Two-zone and three-zone designs

  • Two-zone system: the specimen basket moves vertically between a pre-heated zone and a pre-cooled zone. Basket transfer time is ≤ 10 seconds, and temperature recovery is within specification typically in ≤ 5 minutes.
  • Three-zone system: hot, cold and ambient zones are separate; the specimen can be kept stationary while air is switched between zones. Transition time is ≤ 3–10 seconds and mechanical stress from basket movement is eliminated.
  • The three-zone layout favours precision electronic assemblies, semiconductor devices and aerospace components where repeatability and data consistency are important.

Basket transfer between hot and cold zones

Configuration and features

  • Temperature range -70 °C to +200 °C.
  • Preheating range +60 °C to +200 °C; heating rate +60 °C to +200 °C ≤ 20 min.
  • Cooling rate from +20 °C to -70 °C ≤ 30 min.
  • Fast temperature transition and controlled recovery support repeated thermal shock cycling (>2000 cycles of continuous testing on supported configurations).
  • PID control with touchscreen programming and RS-485 communication.
  • Options include the number of basket positions, load capacity and test fixtures, selected against the specimen and load profile.

Specifications

Parameter Value
Temperature range -70 °C to +200 °C
Transition (basket transfer) time ≤ 10 s (two-zone); ≤ 3–10 s (three-zone)
Temperature recovery within specification, typically ≤ 5 min
Preheating range +60 °C to +200 °C
Heating rate (+60 → +200 °C) ≤ 20 min
Cooling rate (+20 → -70 °C) ≤ 30 min
Control PID, touchscreen, RS-485

Model designations include the ETS series (for example ETS200-40W, ETS200-55W); the final specification depends on chamber model, transition requirement and test load.

Rapid temperature recovery

Standards

Chambers can be configured for test programs based on MIL-STD-810H Method 503.7, IEC 60068-2-14, JESD22-A104, GJB150.5A-2009 and ISO 16750.

To select a two-zone or three-zone configuration, contact us with the specimen, required temperature range and transition requirement. Related: Rapid Temperature Change Chamber, High and Low Temperature (Humidity) Test Chamber.